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Contactless Card Module (Code: MOA2 Module) |
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Contactless Card Modules Type
(MOA-2 )
Leadframe type & manufacturer
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MOA-2 & HERAEUS |
Molding compound type & manufacturer
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MP-8000H-DX & NITTO |
Modules size (mm)
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5.0 * 4.8 |
Modules thickness (mm)
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0.39 + 0.01 |
Molding temp. (℃)
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175 + 5 |
Reject hole dia (mm)
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2 + 0.05 |
Reject hole |
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